25um HD electrolytic ED copper foil for Polyimide board
Overview:
Rang of Thickness: 25micron
Range of Width: 1380 mm
Range of Length: 500-5000 M
Available ID: 76 mm,152 mm
Purity:99.8%
Features of high ductility ED copper foil:
1. Good etch ability
2. Excellent adhesion to etching resist
Classify :
The ED copper foils for PCB can be divided into below parts:
(STD-E)- standard electrodeposited copper foil
(HD-E)-high ductility electrodeposited copper foil
(HTE-E)-high temperature elongation electrodeposited copper foil
(LP-E)-low profile electrodeposited copper foil
(VLP-E)-very low profile electrodeposited copper foil
difference between CA copper foil and ED copper foil
1. Process: rolled copper foil (Rolling process),ED copper foil (Electrodeposition process)
2. Density: rolled copper foil higher density, the surface is relatively smooth, conducive to the production of printed circuit board after the rapid transmission of the signal, so high-frequency high-speed transmission, fine lines printed circuit board also used some calendering copper Foil.
3. Surface treatment width:rolled copper foil be limited by Surface treatment widest effective width of 520mm.
Package:wooden box
FAQ:
Q1: What's your guarantee?
A: All our products have 6 months guarantee after received goods, if any quality problem can contact us.
Q2: What's your delivery time ?
A: The common delivery time is 5-35 working days. The specific delivery time depends on the items and the quantity of your order.
Q3: What's your minimum order quantity?
A: MOQ is 150 kg.
Typical properties of high ductility copper foil
|
Classification
|
Unit |
Requirement |
Test Method |
| Foil Designation |
/ |
T |
H |
M |
1 |
2 |
3 |
IPC-4562A |
| Nominal thickness |
/ |
12um |
1/2 OZ |
3/4 OZ |
1
OZ
|
2
OZ
|
3
OZ
|
IPC-4562A |
| Area Weight |
g/㎡ |
107±4 |
153±5 |
228±8 |
285±10 |
580±15 |
860±20 |
IPC-TM-650
2.2.12.2
|
| Purity |
％ |
≥99.8 |
IPC-TM-650
2.3.15
|
| Foil Profile |
Shiny side (Ra) |
սm |
≤0.4 |
≤0.4 |
≤0.4 |
≤0.4 |
≤0.4 |
≤0.4 |
IPC-TM-650
2.3.17
|
| Matte side(Rz) |
um |
≤6 |
≤8 |
≤10 |
≤10 |
≤15 |
≤20 |
| Tensile Strength |
R.T.(23℃)
|
Mpa |
≥150 |
≥150 |
≥235 |
≥280 |
≥280 |
≥280 |
IPC-TM-650
2.3.18
|
| Elongation |
R.T.(23℃)
|
％ |
≥5 |
≥5 |
≥10 |
≥10 |
≥15 |
≥15 |
IPC-TM-650
2.3.18
|
| Subject |
Ω.g/㎡ |
≤0.170 |
≤0.166 |
≤0.162 |
≤0.162 |
≤0.162 |
≤0.162 |
IPC-TM-650
2.5.14
|
| Peel Strength(FR-4) |
N/mm |
≥1.0 |
≥1.3 |
≥1.6 |
≥1.6 |
≥2.1 |
≥2.1 |
IPC-TM-650
2.4.8
|
| Pinholes&porosity |
Number |
No |
IPC-TM-650
2.1.2
|
| Anti-oxidization |
R.T.(23℃) |
day |
180 |
/ |
| H.T.(200℃) |
Minutes |
60 |
/ |
Product Tags:
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HD Electrolytic Pure Copper Foil For Polyimide Board RoHS / SGS Approval Images
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